SE97B_1
?NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 27 January 2010
35 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
9. Application design-in information
In a typical application, the SE97B behaves as a slave device and interfaces to a bus
master (or host) via the SCL and SDA lines. The EVENT
output is monitored by the host,
and asserts when the temperature reading exceeds the programmed values in the alarm
registers. The A0, A1 and A2 pins are directly connected to V
DD
or V
SS
without any pull-up
resistors. The SDA and SCL serial interface pins are open-drain I/Os that require pull-up
resistors, and are able to sink a maximum of 3 mA with a voltage drop less than 0.4 V.
Typical pull-up values for SCL and SDA are 10 k? but the resistor values can be changed
in order to meet the rise time requirement if the capacitance load is too large due to
routing, connectors, or multiple components sharing the same bus.
Fig 19. Typical application showing SE97B interfacing with 3.3 V host
002aae313
HOST
CONTROLLER
SE97B
A0
A1
A2
SCL
SDA
EVENT
V
DD
10 k?/DIV>
(3?
V
SS
slave
master
3.3 V
Fig 20. SE97B interfacing with 1.0 V host controller
002aae314
HOST
CONTROLLER
SE97B
A0
A1
A2
SCL
SDA
EVENT
V
DD
10 k?/DIV>
V
SS
3.3 V
0.1 糉
10 k?/DIV>
PCA9509
mother board
0.1 糉
V
CC(B)
B2
B1
EN
V
CC(A)
A2
A1
10 k?/DIV>
10 k?/DIV>
SCL
SDA
EVENT
0.1 糉
1.0 V ?5 %
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